U.S. And India Partner For A Stronger Semiconductor Future

The United States and India’s semiconductor groups have teamed up to reinforce their cooperation in the global semiconductor industry. This joint effort aims to bolster the partnership between the two nations and enhance public-private collaboration in the chip ecosystem.

U.S. and India Semiconductor Groups Initiative to Strengthen Public-Private Collaboration in Chip Ecosystem

The U.S. and Indian semiconductor groups signed an MoU in April 2022 to boost cooperation and explore new opportunities in the sector. This collaboration is part of the iCET initiative, which aims to strengthen technology partnerships and industrial collaboration between the two countries through partnerships between governments, businesses, and academic institutions.

The objectives of the task force are as follows:

  • Conduct a readiness assessment of India’s semiconductor ecosystem.
  • Gather industry, government, and academic partners to spot short-term industry opportunities and support the long-term development of compatible semiconductor ecosystems.
  • Provide suggestions on ways to boost India’s position in the global semiconductor value chain, including chip production.
  • Spot and advance workforce development and exchange programs for mutual benefit.

The task force will concentrate on evaluating the state of India’s semiconductor industry through a “readiness assessment”. By bringing together industry, government, and academic stakeholders, the task force aims to identify short-term industry opportunities and support the long-term growth of compatible semiconductor ecosystems.

It will provide suggestions on ways to enhance India’s position in the global semiconductor market, including chip manufacturing.

The task force will also strive to create workforce development and exchange programs for the benefit of both countries. To support its goal of becoming a leading semiconductor nation, India has launched a Rs 76,000 crore semiconductor scheme that aims to establish semiconductor and display fabrication facilities and the corresponding chip ecosystem.

Speaking on the announcement, SIA President and CEO John Neuffer, said,

We are thrilled to kick off this new initiative with IESA, our counterpart in India. India is already a major hub for semiconductor research, chip design, and equipment engineering, but its future potential is even greater. This task force will help identify tangible ways to unlock this potential by increasing collaboration between the U.S. and India within the global chip ecosystem.

Commenting on the partnership, IESA President and CEO Krishna Moorthy, said,

IESA is excited to be part of this new taskforce in partnership with SIA. It will be an important platform to bring together global resources to identify actionable plans to support India to increase its presence in the world-wide chip industry and then enable global collaboration to execute the plans across all segments of the design and manufacturing supply chain, as well as creating semiconductor talent for the world.