Thursday , July 25 2024

MediaTek Dimensity 6100+ 6nm 5G SoC Announced

MediaTek Dimensity 6100+ 6nm 5G SoC Announced

MediaTek Dimensity 6100+ 6nm 5G SoC Announced

MediaTek has introduced Dimensity 6100+ SoC in the Dimensity 6000 series after the launch of Dimensity 6020 and 6080 SoCs. It integrates an enhanced 5G modem supporting 3GPP Release 16 standard with up to 140MHz 2CC 5G Carrier Aggregation and has MediaTek UltraSave 3.0+ technology for power saving.

The chip has two Arm Cortex-A76 big cores and six Arm Cortex-A55 efficiency cores, supports AI-powered cameras, 10-bit displays, outstanding UX and GPU performance, and rich peripheral features.

The Dimensity 9000 series is designed for flagship smartphones and tablets, the Dimensity 8000 family is geared for premium mobile devices, the Dimensity 7000 lineup expands the company’s range of high-tech devices and new Dimensity 6000 series will now democratize higher-end features to mainstream 5G devices, said MediaTek.

Dimensity 6100+ Dimensity 6020 Dimensity 6080
Process TSMC N6 (6nm-class) TSMC N7 (7nm-class)
CPU 2x Cortex-A76 @ 2.2GHz 6x Cortex-A55 @ 2GHz 2x Cortex-A76 @ 2.4GHz 6x Cortex-A55 @ 2GHz 2x Cortex-A76 @ 2.2GHz 6x Cortex-A55 @ 2GHz
Memory LPDDR4x 2133MHz, UFS 2.2 (2-lane)
Camera 16MP+16MP, 108MP,Hardware MFNR, 3DNR, AI-FD 16MP+16MP, 64MP, Hardware MFNR, 3DNR, AI-FD
Display 2520 x 1080 (Full HD+) at 21:9 120Hz 2520 x 1080 (Full HD+) at 21:9 90Hz, 120Hz optional
Video Decode / Video Encode 2160p (2160 x 1080), h.264, h.265 / HEVC 4K 30fps
Graphics Mali-G57 MC2
Modem 2G / 3G / 4G / 5G Multi-Mode, 4G Carrier Aggregation (CA), 5G Carrier Aggregation (CA), EDGE, 4G FDD / TDD, 5G FDD / TDD, GSM, TD-SCDMA, WDCDMA
Connectivity Integrated Dual-Band Wi-Fi 5 (a/b/g/n/ac), Bluetooth 5.2, GPS L1CA+L5
BeiDou B1I+ B2a
Glonass L1OF
Galileo E1 + E5a
QZSS L1CA+ L5
NavIC
Integrated Dual-Band Wi-Fi 5 (a/b/g/n/ac), Bluetooth 5.1,
GPS L1CA+L5
BeiDou B1I+ B2a
Glonass L1OF
Galileo E1 + E5a
QZSS L1CA+ L5
NavIC

Availability

The first smartphones powered by Dimensity 6100+ SoC will be available in the third quarter of 2023, said the company.

Commenting on the launch, CH Chen, Deputy General Manager of MediaTek’s Wireless Communications Business Unit, said:

As developing markets continue rolling out 5G networks at a rapid pace and operators in developed markets work to finish transitioning consumers from 4G LTE to 5G, there has never been a more vital need for chipsets that cater to the growing number of mainstream mobile devices that feature next-generation connectivity.

The MediaTek Dimensity 6000 series makes it possible for device makers to stay ahead of the curve with impressive upgrades that boost performance, increase power efficiency and reduce material costs.

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